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CELL PHONE DESIGN USING

ULTRA THIN ZINC DIE CASTING

EMI SHIELDING 

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  • Use the top of the shield as a structural component.

  • Use shield to stiffen circuit board and back up keypad.

  • Remove keypad circuit contacts from circuit board.

  • Reduce size of circuit board.

  • 20db improvement  in shielding over conductive painted plastic.

  • 0.4mm Thick

  • Lower Total Cost Solution

  • Used by Major Cell Phone OEM

  Cell Phone Assembly with Zinc EMI Shield

TECHNICAL SPECS AND COMPARISON

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Cell Phone with Zinc Shield Exploded