EMI SHIELDING
ULTRA THIN ZINC DIE CASTING
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EMI SHIELDING ULTRA THIN ZINC DIE CASTING |
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Introducing a new technology for EMI shielding of cell phones and other electronic devices. Keumho Company has invested nearly 2 years developing the technology to mass-produce "Ultra Thin Zinc Die Castings". A major cell phone OEM has adopted this as their standard shielding technology for cell phone designs. This technology has the capability of producing a 50mm X 80mm X 0.4mm thick die cast shield, including the copper and nickel plating, with a flatness specification of 0.05mm/25mm. Very tight dimensional tolerances on the shield allow closer placement of components resulting in a smaller package size. The low flatness variation of the shield allows automated gasketing without special preparations. The pure copper layer in the plated film is effective for EMI shielding with a conductive gasket. The structural rigidity of zinc allows the shield to be designed as a load bearing component in the phone. The shield can be used to support the keypad or add strength to a circuit board. Ultra Thin Zinc Die Casting technology is designed for high volume production that results in one of the most cost effective shielding technologies available. See how a zinc die cast shield can reduce the size of your cell phone design |
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